- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 41/312 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by laminating or bonding of piezo-electric or electrostrictive bodies
Patent holdings for IPC class H01L 41/312
Total number of patents in this class: 200
10-year publication summary
|
16
|
24
|
25
|
33
|
30
|
19
|
17
|
5
|
0
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Soitec | 976 |
32 |
| Murata Manufacturing Co., Ltd. | 24144 |
26 |
| NGK Insulators, Ltd. | 4856 |
18 |
| Shin-Etsu Chemical Co., Ltd. | 5557 |
15 |
| Seiko Epson Corporation | 19189 |
9 |
| Taiyo Yuden Co., Ltd. | 1906 |
6 |
| FUJIFILM Corporation | 29095 |
5 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10750 |
5 |
| Qorvo US, Inc. | 2173 |
5 |
| Kyocera Corporation | 13556 |
4 |
| Massachusetts Institute of Technology | 9938 |
3 |
| Konica Minolta, Inc. | 8624 |
3 |
| Akoustis, Inc. | 164 |
3 |
| AMOREPACIFIC Corporation | 2809 |
3 |
| Ricoh Company, Ltd. | 13197 |
2 |
| TDK Corporation | 6633 |
2 |
| Korea Advanced Institute of Science and Technology | 4271 |
2 |
| Boe Technology Group Co., Ltd. | 40205 |
2 |
| FUJIFILM Dimatix, Inc. | 291 |
2 |
| Magnecomp Corporation | 198 |
2 |
| Other owners | 51 |