- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
Patent holdings for IPC class H01L 25/065
Total number of patents in this class: 18347
10-year publication summary
|
1147
|
1245
|
1313
|
1415
|
1458
|
1570
|
1714
|
1917
|
2294
|
2398
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46161 |
3221 |
| Samsung Electronics Co., Ltd. | 149087 |
2268 |
| Intel Corporation | 46460 |
1329 |
| Micron Technology, Inc. | 26558 |
1019 |
| SK Hynix Inc. | 11676 |
427 |
| Kioxia Corporation | 10452 |
394 |
| Qualcomm Incorporated | 87585 |
356 |
| International Business Machines Corporation | 61721 |
297 |
| Invensas Corporation | 611 |
227 |
| Yangtze Memory Technologies Co., Ltd. | 2956 |
210 |
| Advanced Semiconductor Engineering, Inc. | 1679 |
197 |
| Sandisk Technologies Inc. | 5030 |
196 |
| Murata Manufacturing Co., Ltd. | 25001 |
168 |
| Nanya Technology Corporation | 2660 |
166 |
| STATS ChipPAC Pte. Lte. | 1546 |
159 |
| Advanced Micro Devices, Inc. | 5803 |
152 |
| Xilinx, Inc. | 3947 |
143 |
| Adeia Semiconductor Bonding Technologies Inc. | 410 |
136 |
| Infineon Technologies AG | 8287 |
129 |
| Sony Semiconductor Solutions Corporation | 10823 |
129 |
| Other owners | 7024 |