- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 29/08 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
Patent holdings for IPC class H01L 29/08
Total number of patents in this class: 12017
10-year publication summary
|
1346
|
1295
|
1495
|
1365
|
1088
|
756
|
592
|
666
|
554
|
111
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48140 |
2147 |
| International Business Machines Corporation | 62596 |
815 |
| Samsung Electronics Co., Ltd. | 157039 |
793 |
| Samsung Display Co., Ltd. | 38470 |
571 |
| Intel Corporation | 47048 |
458 |
| GLOBALFOUNDRIES U.S. Inc. | 6401 |
411 |
| Fuji Electric Co., Ltd. | 5448 |
295 |
| United Microelectronics Corp. | 4494 |
217 |
| LG Display Co., Ltd. | 14919 |
215 |
| Texas Instruments Incorporated | 19660 |
205 |
| Infineon Technologies AG | 8401 |
202 |
| Boe Technology Group Co., Ltd. | 43856 |
190 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1736 |
137 |
| Renesas Electronics Corporation | 5876 |
135 |
| Infineon Technologies Austria AG | 2322 |
134 |
| Toshiba Corporation | 12551 |
132 |
| Micron Technology, Inc. | 27589 |
126 |
| Rohm Co., Ltd. | 6805 |
123 |
| Denso Corporation | 25471 |
102 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1031 |
101 |
| Other owners | 4508 |