- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/11 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass
Patent holdings for IPC class H01L 25/11
Total number of patents in this class: 784
10-year publication summary
|
66
|
92
|
108
|
104
|
77
|
40
|
44
|
39
|
48
|
8
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 41238 |
71 |
| Intel Corporation | 46302 |
36 |
| Samsung Electronics Co., Ltd. | 140991 |
25 |
| Mitsubishi Electric Corporation | 45186 |
25 |
| Denso Corporation | 23939 |
24 |
| Micron Technology, Inc. | 26016 |
19 |
| Fuji Electric Co., Ltd. | 5034 |
19 |
| Murata Manufacturing Co., Ltd. | 23996 |
18 |
| Siemens AG | 24563 |
16 |
| Infineon Technologies Americas Corp. | 709 |
16 |
| Rohm Co., Ltd. | 6409 |
15 |
| Semiconductor Components Industries, L.L.C. | 5241 |
15 |
| ABB Schweiz AG | 6740 |
15 |
| Infineon Technologies AG | 8152 |
12 |
| Invensas Corporation | 616 |
12 |
| International Business Machines Corporation | 60408 |
11 |
| Institut VEDECOM | 62 |
10 |
| Sony Corporation | 31355 |
8 |
| Dynex Semiconductor Limited | 60 |
7 |
| Seoul Viosys Co., Ltd. | 1449 |
7 |
| Other owners | 403 |