- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices having separate containers
Patent holdings for IPC class H01L 25/10
Total number of patents in this class: 3576
10-year publication summary
312
|
277
|
337
|
314
|
304
|
230
|
274
|
304
|
403
|
80
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 41238 |
995 |
Samsung Electronics Co., Ltd. | 140991 |
583 |
Intel Corporation | 46302 |
147 |
STATS ChipPAC Pte. Lte. | 1539 |
117 |
Invensas Corporation | 616 |
96 |
Micron Technology, Inc. | 26016 |
88 |
Qualcomm Incorporated | 82975 |
85 |
Murata Manufacturing Co., Ltd. | 23996 |
55 |
Tessera, Inc. | 629 |
55 |
Mediatek Inc. | 4878 |
53 |
Amkor Technology Singapore Holding Pte. Ltd | 390 |
53 |
Jcet Semiconductor (shaoxing) Co., Ltd. | 364 |
52 |
Siliconware Precision Industries Co., Ltd. | 552 |
50 |
Advanced Semiconductor Engineering, Inc. | 1617 |
43 |
Apple Inc. | 53438 |
41 |
Shinko Electric Industries Co., Ltd. | 1203 |
34 |
Adeia Semiconductor Technologies LLC | 142 |
32 |
Rambus Inc. | 2339 |
29 |
Amkor Technology Singapore Holding Pte.ltd. | 517 |
20 |
Samsung Electro-mechanics Co., Ltd. | 5302 |
18 |
Other owners | 930 |