- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
Patent holdings for IPC class H01L 23/538
Total number of patents in this class: 11907
10-year publication summary
|
622
|
816
|
1020
|
1178
|
1116
|
1156
|
1084
|
1337
|
1482
|
431
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47071 |
2364 |
| Intel Corporation | 46673 |
1179 |
| Samsung Electronics Co., Ltd. | 153093 |
1166 |
| Qualcomm Incorporated | 89928 |
330 |
| Advanced Semiconductor Engineering, Inc. | 1701 |
271 |
| Micron Technology, Inc. | 27238 |
259 |
| STATS ChipPAC Pte. Lte. | 982 |
140 |
| Amkor Technology Singapore Holding Pte. Ltd | 461 |
137 |
| Infineon Technologies AG | 8380 |
134 |
| International Business Machines Corporation | 62148 |
129 |
| Murata Manufacturing Co., Ltd. | 25464 |
121 |
| Apple Inc. | 57989 |
118 |
| Mediatek Inc. | 5365 |
117 |
| Samsung Electro-mechanics Co., Ltd. | 5805 |
102 |
| Siliconware Precision Industries Co., Ltd. | 659 |
97 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 358 |
89 |
| SK Hynix Inc. | 12086 |
86 |
| Fuji Electric Co., Ltd. | 5373 |
85 |
| Adeia Semiconductor Technologies LLC | 487 |
83 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 528 |
82 |
| Other owners | 4818 |