- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
Patent holdings for IPC class H01L 23/52
Total number of patents in this class: 5289
10-year publication summary
|
334
|
341
|
296
|
277
|
266
|
162
|
117
|
73
|
42
|
7
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 41238 |
561 |
| Samsung Electronics Co., Ltd. | 140991 |
310 |
| Micron Technology, Inc. | 26016 |
179 |
| Renesas Electronics Corporation | 6134 |
166 |
| Intel Corporation | 46302 |
132 |
| STATS ChipPAC Pte. Lte. | 1539 |
131 |
| Infineon Technologies AG | 8152 |
126 |
| Panasonic Corporation | 20253 |
115 |
| International Business Machines Corporation | 60408 |
106 |
| GLOBALFOUNDRIES U.S. Inc. | 6443 |
105 |
| Texas Instruments Incorporated | 19458 |
95 |
| Kioxia Corporation | 10231 |
75 |
| SK Hynix Inc. | 10987 |
65 |
| Advanced Semiconductor Engineering, Inc. | 1617 |
59 |
| Qualcomm Incorporated | 82975 |
58 |
| Tokyo Electron Limited | 12278 |
53 |
| Rohm Co., Ltd. | 6409 |
52 |
| Amkor Technology Singapore Holding Pte.ltd. | 517 |
47 |
| Tahoe Research, Ltd. | 2038 |
44 |
| Tessera, Inc. | 629 |
43 |
| Other owners | 2767 |