- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
Patent holdings for IPC class H01L 23/48
Total number of patents in this class: 16503
10-year publication summary
|
1074
|
992
|
956
|
993
|
905
|
925
|
1000
|
1176
|
1057
|
277
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47156 |
2634 |
| Samsung Electronics Co., Ltd. | 153357 |
1425 |
| Intel Corporation | 46633 |
861 |
| Micron Technology, Inc. | 27251 |
525 |
| International Business Machines Corporation | 62153 |
416 |
| Mitsubishi Electric Corporation | 47529 |
262 |
| Rohm Co., Ltd. | 6734 |
257 |
| Infineon Technologies AG | 8381 |
256 |
| Qualcomm Incorporated | 90013 |
230 |
| Renesas Electronics Corporation | 5875 |
218 |
| SK Hynix Inc. | 12108 |
215 |
| GLOBALFOUNDRIES U.S. Inc. | 6396 |
213 |
| Texas Instruments Incorporated | 19621 |
212 |
| Kioxia Corporation | 10703 |
197 |
| Advanced Semiconductor Engineering, Inc. | 1701 |
175 |
| Nanya Technology Corporation | 2840 |
154 |
| STATS ChipPAC Pte. Lte. | 982 |
153 |
| Adeia Semiconductor Technologies LLC | 585 |
141 |
| Fuji Electric Co., Ltd. | 5377 |
128 |
| Changxin Memory Technologies, Inc. | 4924 |
125 |
| Other owners | 7706 |