- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/367 - Cooling facilitated by shape of device
Patent holdings for IPC class H01L 23/367
Total number of patents in this class: 6820
10-year publication summary
|
504
|
603
|
663
|
661
|
655
|
621
|
599
|
714
|
759
|
187
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47071 |
665 |
| Samsung Electronics Co., Ltd. | 153093 |
359 |
| Intel Corporation | 46673 |
356 |
| Mitsubishi Electric Corporation | 47522 |
195 |
| International Business Machines Corporation | 62148 |
185 |
| Micron Technology, Inc. | 27238 |
131 |
| Huawei Technologies Co., Ltd. | 119637 |
115 |
| Infineon Technologies AG | 8380 |
113 |
| Fuji Electric Co., Ltd. | 5373 |
108 |
| Qualcomm Incorporated | 89928 |
102 |
| Denso Corporation | 25132 |
98 |
| Semiconductor Components Industries, L.L.C. | 5265 |
83 |
| Monolithic 3D Inc. | 328 |
74 |
| Rohm Co., Ltd. | 6727 |
69 |
| Advanced Semiconductor Engineering, Inc. | 1701 |
67 |
| Texas Instruments Incorporated | 19614 |
66 |
| NXP USA, Inc. | 4419 |
63 |
| Qorvo US, Inc. | 2360 |
59 |
| Siemens AG | 24237 |
56 |
| Murata Manufacturing Co., Ltd. | 25464 |
54 |
| Other owners | 3802 |