- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
Patent holdings for IPC class H01L 23/28
Total number of patents in this class: 2208
10-year publication summary
|
163
|
210
|
183
|
177
|
131
|
153
|
100
|
78
|
123
|
39
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Murata Manufacturing Co., Ltd. | 25809 |
215 |
| Mitsubishi Electric Corporation | 48172 |
180 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48560 |
102 |
| Rohm Co., Ltd. | 6877 |
94 |
| Intel Corporation | 47178 |
61 |
| STATS ChipPAC Pte. Lte. | 971 |
52 |
| Samsung Electronics Co., Ltd. | 158442 |
49 |
| Denso Corporation | 25645 |
49 |
| STATS ChipPAC Management Pte. Ltd. | 542 |
41 |
| Texas Instruments Incorporated | 19640 |
36 |
| Infineon Technologies AG | 8410 |
35 |
| Panasonic Corporation | 18849 |
33 |
| Fuji Electric Co., Ltd. | 5511 |
33 |
| Advanced Semiconductor Engineering, Inc. | 1751 |
30 |
| Micron Technology, Inc. | 27636 |
27 |
| Shindengen Electric Manufacturing Co., Ltd. | 843 |
24 |
| Sony Semiconductor Solutions Corporation | 11717 |
20 |
| Hitachi Automotive Systems, Ltd. | 3954 |
19 |
| Renesas Electronics Corporation | 5862 |
19 |
| Amkor Technology Singapore Holding Pte.ltd. | 483 |
16 |
| Other owners | 1073 |