• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/84 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body

Patent holdings for IPC class H01L 21/84

Total number of patents in this class: 3845

10-year publication summary

487
491
415
316
215
138
153
110
44
6
2017 2018 2019 2020 2021 2022 2023 2024 2025 2026

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
48140
550
International Business Machines Corporation
62596
424
GLOBALFOUNDRIES U.S. Inc.
6401
329
Samsung Electronics Co., Ltd.
157039
172
Boe Technology Group Co., Ltd.
43856
129
Semiconductor Energy Laboratory Co., Ltd.
11775
120
Intel Corporation
47048
115
Qualcomm Incorporated
91706
84
Monolithic 3D Inc.
331
75
Renesas Electronics Corporation
5876
69
Samsung Display Co., Ltd.
38470
66
Commissariat à l'énergie atomique et aux energies alternatives
11118
64
Semiconductor Manufacturing International (Shanghai) Corporation
1736
63
Adeia Semiconductor Solutions LLC
762
63
United Microelectronics Corp.
4494
61
Micron Technology, Inc.
27589
48
Institute of Microelectronics, Chinese Academy of Sciences
1457
45
Shenzhen China Star Optoelectronics Technology Co., Ltd.
8472
39
Au Optronics Corporation
3220
36
Skyworks Solutions, Inc.
3943
35
Other owners 1258