- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
Patent holdings for IPC class H01L 21/768
Total number of patents in this class: 27530
10-year publication summary
|
2369
|
2533
|
2610
|
2728
|
2407
|
2382
|
2239
|
2130
|
1932
|
368
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47071 |
6539 |
| International Business Machines Corporation | 62148 |
1463 |
| Samsung Electronics Co., Ltd. | 153093 |
1437 |
| Applied Materials, Inc. | 19938 |
1096 |
| Intel Corporation | 46673 |
960 |
| Micron Technology, Inc. | 27238 |
899 |
| Tokyo Electron Limited | 13465 |
703 |
| GLOBALFOUNDRIES U.S. Inc. | 6398 |
649 |
| Nanya Technology Corporation | 2831 |
504 |
| United Microelectronics Corp. | 4425 |
460 |
| Changxin Memory Technologies, Inc. | 4924 |
416 |
| Kioxia Corporation | 10704 |
401 |
| SK Hynix Inc. | 12086 |
399 |
| Sony Semiconductor Solutions Corporation | 11176 |
360 |
| Lam Research Corporation | 5500 |
354 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1739 |
274 |
| Qualcomm Incorporated | 89928 |
265 |
| Yangtze Memory Technologies Co., Ltd. | 3124 |
264 |
| Sandisk Technologies Inc. | 5344 |
258 |
| Adeia Semiconductor Solutions LLC | 758 |
232 |
| Other owners | 9597 |