- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
Patent holdings for IPC class H01L 21/68
Total number of patents in this class: 3369
10-year publication summary
177
|
248
|
285
|
312
|
320
|
293
|
295
|
244
|
289
|
56
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Applied Materials, Inc. | 18082 |
223 |
Tokyo Electron Limited | 12278 |
209 |
Nikon Corporation | 7121 |
176 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 41238 |
153 |
Lam Research Corporation | 5078 |
97 |
Samsung Electronics Co., Ltd. | 140991 |
71 |
Screen Holdings Co., Ltd. | 2694 |
56 |
EV Group E. Thallner GmbH | 398 |
54 |
Disco Corporation | 1826 |
53 |
ASML Netherlands B.V. | 7236 |
49 |
Samsung Display Co., Ltd. | 33362 |
37 |
KLA Corporation | 1447 |
35 |
Semes Co., Ltd. | 1361 |
34 |
Boe Technology Group Co., Ltd. | 39745 |
32 |
Brooks Automation US, LLC | 351 |
32 |
Cowles Semi, LLC | 70 |
31 |
Shanghai Micro Electronics Equipment (Group) Co., Ltd. | 251 |
30 |
Canon Inc. | 38689 |
27 |
Kawasaki Heavy Industries, Limited | 1617 |
27 |
Changxin Memory Technologies, Inc. | 4927 |
25 |
Other owners | 1918 |