- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
Patent holdings for IPC class H01L 21/56
Total number of patents in this class: 15817
10-year publication summary
|
1427
|
1440
|
1446
|
1571
|
1421
|
1286
|
1270
|
1450
|
1228
|
51
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46375 |
3350 |
| Samsung Electronics Co., Ltd. | 150361 |
751 |
| Intel Corporation | 46522 |
522 |
| Texas Instruments Incorporated | 19516 |
514 |
| Infineon Technologies AG | 8298 |
443 |
| STATS ChipPAC Pte. Lte. | 1551 |
440 |
| Advanced Semiconductor Engineering, Inc. | 1683 |
379 |
| Micron Technology, Inc. | 26782 |
296 |
| Amkor Technology Singapore Holding Pte. Ltd | 445 |
252 |
| Siliconware Precision Industries Co., Ltd. | 641 |
240 |
| Semiconductor Components Industries, L.L.C. | 5297 |
230 |
| NXP USA, Inc. | 4374 |
191 |
| Mitsubishi Electric Corporation | 47219 |
179 |
| Rohm Co., Ltd. | 6628 |
172 |
| Qualcomm Incorporated | 88235 |
163 |
| Renesas Electronics Corporation | 5908 |
155 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 361 |
127 |
| Murata Manufacturing Co., Ltd. | 25187 |
124 |
| Amkor Technology Singapore Holding Pte.ltd. | 496 |
118 |
| International Business Machines Corporation | 61846 |
117 |
| Other owners | 7054 |