- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
Patent holdings for IPC class H01L 21/48
Total number of patents in this class: 14120
10-year publication summary
|
1299
|
1322
|
1280
|
1393
|
1242
|
1298
|
1210
|
1328
|
1347
|
569
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48140 |
2299 |
| Intel Corporation | 47048 |
956 |
| Samsung Electronics Co., Ltd. | 157039 |
635 |
| Texas Instruments Incorporated | 19660 |
465 |
| Advanced Semiconductor Engineering, Inc. | 1735 |
382 |
| Infineon Technologies AG | 8401 |
301 |
| Qualcomm Incorporated | 91706 |
274 |
| International Business Machines Corporation | 62596 |
240 |
| Semiconductor Components Industries, L.L.C. | 5268 |
223 |
| Micron Technology, Inc. | 27589 |
218 |
| Amkor Technology Singapore Holding Pte. Ltd | 478 |
194 |
| STATS ChipPAC Pte. Lte. | 978 |
189 |
| Siliconware Precision Industries Co., Ltd. | 685 |
188 |
| Shinko Electric Industries Co., Ltd. | 1227 |
183 |
| NXP USA, Inc. | 4390 |
156 |
| Mitsubishi Electric Corporation | 47893 |
152 |
| Adeia Semiconductor Technologies LLC | 585 |
144 |
| Fuji Electric Co., Ltd. | 5448 |
131 |
| Rohm Co., Ltd. | 6805 |
129 |
| Renesas Electronics Corporation | 5876 |
101 |
| Other owners | 6560 |