- All sections
- H - Electricity
- H01C - Resistors
- H01C 1/03 - HousingEnclosingEmbeddingFilling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath with powdered insulation
Patent holdings for IPC class H01C 1/03
Total number of patents in this class: 8
10-year publication summary
|
0
|
0
|
3
|
0
|
1
|
1
|
0
|
0
|
0
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Denso Corporation | 24069 |
1 |
| Amotech Co., Ltd. | 517 |
1 |
| Bradley Fixtures Corporation | 179 |
1 |
| Federal-Mogul Ignition Company | 94 |
1 |
| NHK Spring Co., Ltd. | 1812 |
1 |
| Sensata Technologies, Inc. | 399 |
1 |
| Stoneridge, Inc. | 96 |
1 |
| Siemens Mobility GmbH | 1698 |
1 |
| Other owners | 0 |