- All sections
- C - Chemistrymetallurgy
- C09J - Adhesivesnon-mechanical aspects of adhesive processes in generaladhesive processes not provided for elsewhereuse of materials as adhesives
- C09J 9/02 - Electrically-conducting adhesives
Patent holdings for IPC class C09J 9/02
Total number of patents in this class: 1649
10-year publication summary
|
107
|
130
|
127
|
126
|
107
|
101
|
98
|
109
|
111
|
84
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Dexerials Corporation | 2005 |
183 |
| Hitachi Chemical Company, Ltd. | 2234 |
90 |
| Nitto Denko Corporation | 8565 |
70 |
| Resonac Corporation | 3624 |
69 |
| Henkel AG & Co. KGaA | 10743 |
65 |
| Sekisui Chemical Co., Ltd. | 3638 |
65 |
| 3m Innovative Properties Company | 17459 |
63 |
| Tatsuta Electric Wire & Cable Co., Ltd. | 427 |
46 |
| Sony Chemical & Information Device Corporation | 207 |
33 |
| The Furukawa Electric Co., Ltd. | 3693 |
24 |
| Showa Denko Materials Co., Ltd. | 624 |
24 |
| Lintec Corporation | 2025 |
22 |
| Tesa SE | 1131 |
19 |
| Namics Corporation | 491 |
16 |
| Boe Technology Group Co., Ltd. | 44484 |
15 |
| Tanaka Kikinzoku Kogyo K.K. | 574 |
14 |
| Three Bond Co., Ltd. | 236 |
14 |
| Immunolight, LLC | 212 |
13 |
| Osaka Soda Co., Ltd. | 244 |
13 |
| Sumitomo Bakelite Co., Ltd. | 1542 |
13 |
| Other owners | 778 |