- All sections
- C - Chemistrymetallurgy
- C09J - Adhesivesnon-mechanical aspects of adhesive processes in generaladhesive processes not provided for elsewhereuse of materials as adhesives
- C09J 7/35 - Heat-activated
Patent holdings for IPC class C09J 7/35
Total number of patents in this class: 1171
10-year publication summary
|
15
|
31
|
68
|
138
|
137
|
176
|
196
|
160
|
160
|
119
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Lintec Corporation | 1959 |
66 |
| Resonac Corporation | 2825 |
53 |
| 3m Innovative Properties Company | 17820 |
49 |
| Nitto Denko Corporation | 8261 |
37 |
| Henkel AG & Co. KGaA | 10588 |
34 |
| H.B. Fuller Company | 486 |
28 |
| Dexerials Corporation | 1935 |
23 |
| Hitachi Chemical Company, Ltd. | 2343 |
22 |
| Showa Denko Materials Co., Ltd. | 624 |
22 |
| The Furukawa Electric Co., Ltd. | 3670 |
21 |
| Dow Toray Co., Ltd. | 568 |
21 |
| Dai Nippon Printing Co., Ltd. | 4098 |
20 |
| Tesa SE | 1064 |
20 |
| DIC Corporation | 3803 |
17 |
| Nitto Shinko Corporation | 74 |
17 |
| Toyobo Co., Ltd. | 2501 |
17 |
| Bostik SA | 647 |
16 |
| Toagosei Co., Ltd. | 970 |
16 |
| Sekisui Chemical Co., Ltd. | 3436 |
15 |
| Mitsui Chemicals, Inc. | 3224 |
13 |
| Other owners | 644 |