- All sections
- C - Chemistrymetallurgy
- C09J - Adhesivesnon-mechanical aspects of adhesive processes in generaladhesive processes not provided for elsewhereuse of materials as adhesives
- C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
Patent holdings for IPC class C09J 4/00
Total number of patents in this class: 1492
10-year publication summary
|
132
|
106
|
90
|
111
|
91
|
93
|
83
|
81
|
72
|
50
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| 3m Innovative Properties Company | 17484 |
107 |
| Henkel AG & Co. KGaA | 10768 |
98 |
| Nitto Denko Corporation | 8550 |
68 |
| LG Chem, Ltd. | 17937 |
54 |
| Hitachi Chemical Company, Ltd. | 2238 |
50 |
| Sekisui Chemical Co., Ltd. | 3626 |
40 |
| Dexerials Corporation | 1998 |
36 |
| Lintec Corporation | 2022 |
31 |
| Henkel IP & Holding GmbH | 557 |
29 |
| Toagosei Co., Ltd. | 1026 |
26 |
| Bostik SA | 682 |
24 |
| FUJIFILM Corporation | 30562 |
23 |
| BASF SE | 21310 |
22 |
| Samsung Display Co., Ltd. | 38791 |
20 |
| Avery Dennison Corporation | 1162 |
17 |
| Namics Corporation | 487 |
17 |
| Samsung SDI Co., Ltd. | 10710 |
16 |
| The Furukawa Electric Co., Ltd. | 3698 |
15 |
| Resonac Corporation | 3587 |
14 |
| Oji Holdings Corporation | 798 |
13 |
| Other owners | 772 |