- All sections
- C - Chemistrymetallurgy
- C09J - Adhesivesnon-mechanical aspects of adhesive processes in generaladhesive processes not provided for elsewhereuse of materials as adhesives
- C09J 153/00 - Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsAdhesives based on derivatives of such polymers
Patent holdings for IPC class C09J 153/00
Total number of patents in this class: 539
10-year publication summary
|
65
|
52
|
51
|
32
|
51
|
29
|
31
|
18
|
14
|
19
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Kuraray Co., Ltd. | 3491 |
48 |
| 3m Innovative Properties Company | 17855 |
28 |
| Henkel AG & Co. KGaA | 10482 |
27 |
| Avery Dennison Corporation | 1199 |
26 |
| Tesa SE | 1051 |
24 |
| Nitto Denko Corporation | 8196 |
21 |
| Dow Global Technologies LLC | 10384 |
18 |
| LG Chem, Ltd. | 17564 |
15 |
| Toagosei Co., Ltd. | 961 |
14 |
| Bostik, Inc. | 205 |
11 |
| DIC Corporation | 3759 |
11 |
| Evonik Röhm GmbH | 441 |
10 |
| Arkema France | 4015 |
10 |
| H.B. Fuller Company | 469 |
10 |
| Iowa State University Research Foundation, Inc. | 766 |
10 |
| Shanjin Optoelectronics (Suzhou) Co., Ltd. | 136 |
8 |
| Dai Nippon Printing Co., Ltd. | 4061 |
7 |
| Sekisui Chemical Co., Ltd. | 3378 |
7 |
| Sekisui Fuller Company, Ltd. | 59 |
7 |
| BASF SE | 20803 |
6 |
| Other owners | 221 |