- All sections
- B - Performing operationstransporting
- B33Y - Additive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering
- B33Y 50/00 - Data acquisition or data processing for additive manufacturing
Patent holdings for IPC class B33Y 50/00
Total number of patents in this class: 3074
10-year publication summary
145
|
268
|
360
|
367
|
425
|
384
|
464
|
382
|
365
|
72
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Hewlett-Packard Development Company, L.P. | 27445 |
303 |
General Electric Company | 17807 |
77 |
Align Technology, Inc. | 1981 |
53 |
Xerox Corporation | 7071 |
44 |
Autodesk, Inc. | 1528 |
39 |
Stratasys Ltd. | 414 |
36 |
Stratasys, Inc. | 695 |
33 |
The Boeing Company | 19930 |
31 |
Siemens AG | 24563 |
30 |
Divergent Technologies, Inc. | 454 |
30 |
3D Systems, Inc. | 591 |
28 |
Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | 2904 |
27 |
Technology Research Association for Future Additive Manufacturing | 120 |
24 |
Concept Laser GmbH | 182 |
24 |
Siemens Industry Software Inc. | 1647 |
24 |
Materialise N.V. | 282 |
22 |
Seiko Epson Corporation | 19030 |
21 |
International Business Machines Corporation | 60232 |
20 |
Formlabs, Inc. | 205 |
20 |
Jabil Inc. | 499 |
19 |
Other owners | 2169 |