- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
Patent holdings for IPC class B24B 7/22
Total number of patents in this class: 643
10-year publication summary
|
47
|
48
|
59
|
52
|
53
|
43
|
51
|
52
|
67
|
28
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1945 |
121 |
| Ebara Corporation | 2278 |
26 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47734 |
23 |
| Tokyo Electron Limited | 13617 |
17 |
| Sumco Corporation | 1114 |
17 |
| Samsung Electronics Co., Ltd. | 155224 |
12 |
| Applied Materials, Inc. | 20145 |
12 |
| Ancora S.p.A. | 26 |
12 |
| Husqvarna AB | 2989 |
11 |
| 3m Innovative Properties Company | 17491 |
8 |
| Shin-Etsu Chemical Co., Ltd. | 5997 |
8 |
| Globalwafers Co., Ltd. | 726 |
8 |
| Shin-Etsu Handotai Co., Ltd. | 1305 |
8 |
| Semiconductor Components Industries, L.L.C. | 5280 |
7 |
| Vertical Concrete Polishing Inc. | 8 |
6 |
| Hangzhou Sizone Electronic Technology Inc. | 82 |
6 |
| Wolfspeed, Inc. | 885 |
6 |
| DuPont Electronic Materials Holding, Inc. | 206 |
6 |
| Corning Incorporated | 10463 |
5 |
| Cambria Company LLC | 347 |
5 |
| Other owners | 319 |