- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 35/34 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
Patent holdings for IPC class B23K 35/34
Total number of patents in this class: 107
10-year publication summary
|
7
|
4
|
4
|
2
|
1
|
1
|
4
|
4
|
4
|
1
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Alfa Laval Corporate AB | 1333 |
6 |
| Hobart Brothers LLC | 107 |
6 |
| Hubbell Incorporated | 3411 |
5 |
| Lincoln Global, Inc. | 2125 |
5 |
| Consolidated Nuclear Security, LLC | 118 |
4 |
| Heraeus Deutschland GmbH & Co. KG | 404 |
4 |
| Hobart Brothers Company | 94 |
4 |
| Electronics and Telecommunications Research Institute | 9534 |
3 |
| Nippon Welding Rod Co., Ltd. | 6 |
3 |
| Senju Metal Industry Co., Ltd. | 683 |
3 |
| Heraeus Electronics GmbH & Co. KG | 111 |
3 |
| The Boeing Company | 20094 |
2 |
| Mitsubishi Heavy Industries, Ltd. | 9030 |
2 |
| Siemens Energy, Inc. | 1694 |
2 |
| The Johns Hopkins University | 5825 |
2 |
| Applied Nanoparticle Laboratory Corporation | 19 |
2 |
| Harima Chemicals, Inc. | 203 |
2 |
| Heraeus Materials Technology GmbH & Co. KG | 28 |
2 |
| Rogers Germany GmbH | 144 |
2 |
| Qualcomm Incorporated | 90545 |
1 |
| Other owners | 44 |