- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 35/34 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
Patent holdings for IPC class B23K 35/34
Total number of patents in this class: 110
10-year publication summary
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5
|
6
|
4
|
4
|
2
|
1
|
1
|
3
|
4
|
2
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Alfa Laval Corporate AB | 1315 |
6 |
| Lincoln Global, Inc. | 2147 |
6 |
| Hobart Brothers LLC | 105 |
5 |
| Hubbell Incorporated | 3283 |
4 |
| Consolidated Nuclear Security, LLC | 124 |
4 |
| Heraeus Deutschland GmbH & Co. KG | 418 |
4 |
| Hobart Brothers Company | 97 |
4 |
| Electronics and Telecommunications Research Institute | 9408 |
3 |
| Nippon Welding Rod Co., Ltd. | 6 |
3 |
| Senju Metal Industry Co., Ltd. | 684 |
3 |
| Heraeus Electronics GmbH & Co. KG | 102 |
3 |
| The Boeing Company | 20090 |
2 |
| Mitsubishi Heavy Industries, Ltd. | 8764 |
2 |
| Siemens Energy, Inc. | 1711 |
2 |
| The Johns Hopkins University | 5679 |
2 |
| Applied Nanoparticle Laboratory Corporation | 19 |
2 |
| Harima Chemicals, Inc. | 205 |
2 |
| Heraeus Materials Technology GmbH & Co. KG | 28 |
2 |
| Nihon Handa Co., Ltd. | 16 |
2 |
| Rogers Germany GmbH | 142 |
2 |
| Other owners | 47 |