- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 3/00 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
Patent holdings for IPC class B23K 3/00
Total number of patents in this class: 350
10-year publication summary
|
29
|
15
|
16
|
37
|
47
|
31
|
31
|
34
|
23
|
14
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 689 |
17 |
| Fuji Corporation | 3457 |
12 |
| Illinois Tool Works Inc. | 11590 |
11 |
| ERSA GmbH | 98 |
11 |
| Hakko Corporation | 119 |
11 |
| Samsung Electronics Co., Ltd. | 149362 |
10 |
| OK International Inc. | 13 |
10 |
| Shinkawa Ltd. | 419 |
10 |
| Mitsubishi Electric Corporation | 47014 |
8 |
| Denso Corporation | 24818 |
7 |
| Panasonic Intellectual Property Management Co., Ltd. | 32551 |
6 |
| Shandong Caiju Electronic Technology Co., Ltd | 12 |
6 |
| International Business Machines Corporation | 61759 |
5 |
| Hubbell Incorporated | 3356 |
5 |
| Apex Brands, Inc. | 718 |
5 |
| FANUC Corporation | 6882 |
5 |
| Kulicke and Soffa Industries, Inc. | 317 |
5 |
| Daikin Industries, Ltd. | 10167 |
4 |
| Hitachi, Ltd. | 15726 |
3 |
| Tyco Electronics (shanghai) Co. Ltd. | 953 |
3 |
| Other owners | 196 |