- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 1/08 - Soldering by means of dipping in molten solder
Patent holdings for IPC class B23K 1/08
Total number of patents in this class: 226
10-year publication summary
|
9
|
21
|
21
|
17
|
7
|
15
|
12
|
7
|
14
|
9
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 695 |
41 |
| Illinois Tool Works Inc. | 11919 |
29 |
| ERSA GmbH | 59 |
15 |
| Mitsubishi Electric Corporation | 48508 |
14 |
| Abbott Cardiovascular Systems, Inc. | 1012 |
6 |
| Omron Corporation | 7438 |
6 |
| Fuji Corporation | 3734 |
6 |
| Alpha Assembly Solutions Inc. | 211 |
5 |
| Flex Ltd. | 212 |
5 |
| Pillarhouse International Limited | 8 |
5 |
| International Business Machines Corporation | 62871 |
4 |
| Panasonic Corporation | 18572 |
4 |
| Nordson Corporation | 1213 |
4 |
| Fujitsu Ten Limited | 433 |
3 |
| Robert Bosch GmbH | 44427 |
3 |
| Linde Aktiengesellschaft | 1410 |
3 |
| Tanigurogumi Corporation | 12 |
3 |
| Tyco Electronics (shanghai) Co. Ltd. | 1081 |
2 |
| Fuji Machine Mfg. Co., Ltd. | 979 |
2 |
| Goertek Inc. | 2858 |
2 |
| Other owners | 64 |