- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 1/015 - Vapour-condensation soldering
Patent holdings for IPC class B23K 1/015
Total number of patents in this class: 36
10-year publication summary
|
1
|
4
|
1
|
3
|
4
|
3
|
5
|
5
|
3
|
1
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 155224 |
6 |
| Yield Engineering SPV LLC | 30 |
4 |
| 3m Innovative Properties Company | 17491 |
3 |
| Panasonic Intellectual Property Management Co., Ltd. | 33812 |
3 |
| Yield Engineering Systems, Inc. | 69 |
3 |
| International Business Machines Corporation | 62325 |
1 |
| Mitsubishi Electric Corporation | 47722 |
1 |
| Tyco Electronics Corporation | 722 |
1 |
| Diamond Innovations, Inc. | 235 |
1 |
| ERSA GmbH | 79 |
1 |
| Kne Kabushiki Kaisha | 2 |
1 |
| Picosun Oy | 157 |
1 |
| Rolls-Royce Corporation | 1681 |
1 |
| Senju Metal Industry Co., Ltd. | 683 |
1 |
| SS Techno, Inc. | 1 |
1 |
| Werkzeugbau Siegfried Hofmann GmbH | 16 |
1 |
| GE Infrastructure Technology, LLC | 6181 |
1 |
| Endress+Hauser SE+Co. KG | 560 |
1 |
| 3s Silicon Tech., Inc. | 2 |
1 |
| Siegfried Hofmann GmbH | 22 |
1 |
| Other owners | 2 |