- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 1/015 - Vapour-condensation soldering
Patent holdings for IPC class B23K 1/015
Total number of patents in this class: 37
10-year publication summary
|
1
|
4
|
1
|
3
|
4
|
3
|
5
|
5
|
3
|
2
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 158605 |
6 |
| Yield Engineering Systems, Inc. | 81 |
4 |
| Yield Engineering SPV LLC | 30 |
4 |
| 3m Innovative Properties Company | 17459 |
3 |
| Panasonic Intellectual Property Management Co., Ltd. | 34335 |
3 |
| International Business Machines Corporation | 62754 |
1 |
| Mitsubishi Electric Corporation | 48236 |
1 |
| Tyco Electronics Corporation | 713 |
1 |
| Diamond Innovations, Inc. | 235 |
1 |
| ERSA GmbH | 59 |
1 |
| Kne Kabushiki Kaisha | 2 |
1 |
| Picosun Oy | 167 |
1 |
| Rolls-Royce Corporation | 1680 |
1 |
| Senju Metal Industry Co., Ltd. | 690 |
1 |
| SS Techno, Inc. | 1 |
1 |
| Werkzeugbau Siegfried Hofmann GmbH | 16 |
1 |
| GE Infrastructure Technology, LLC | 6154 |
1 |
| Endress+Hauser SE+Co. KG | 584 |
1 |
| 3s Silicon Tech., Inc. | 2 |
1 |
| Siegfried Hofmann GmbH | 22 |
1 |
| Other owners | 2 |