- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/38 - Removing material by boring or cutting
Patent holdings for IPC class B23K 26/38
Total number of patents in this class: 3652
10-year publication summary
|
212
|
282
|
310
|
281
|
285
|
266
|
269
|
256
|
287
|
61
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 533 |
150 |
| TRUMPF Werkzeugmaschinen SE + Co. KG | 291 |
111 |
| Bystronic Laser AG | 271 |
103 |
| Disco Corporation | 1925 |
86 |
| Hamamatsu Photonics K.K. | 4593 |
78 |
| Amada Holdings Co., Ltd. | 271 |
71 |
| Amada Company, Limited | 605 |
70 |
| Corning Incorporated | 10406 |
60 |
| Samsung Display Co., Ltd. | 37630 |
54 |
| Mitsubishi Electric Corporation | 47522 |
54 |
| Asahi Glass Company, Limited | 2683 |
38 |
| TRUMPF Laser- und Systemtechnik GmbH | 531 |
38 |
| FANUC Corporation | 7010 |
36 |
| Electro Scientific Industries, Inc. | 364 |
32 |
| Nippon Electric Glass Co., Ltd. | 2513 |
31 |
| Precitec GmbH & Co. KG | 199 |
29 |
| LG Energy Solution, Ltd. | 17308 |
29 |
| IPG Photonics Corporation | 570 |
25 |
| Mitsubishi Heavy Industries, Ltd. | 9010 |
24 |
| Nitto Denko Corporation | 8447 |
24 |
| Other owners | 2509 |