- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Patent holdings for IPC class B23K 26/082
Total number of patents in this class: 2079
10-year publication summary
|
154
|
210
|
214
|
215
|
239
|
214
|
206
|
222
|
199
|
42
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Panasonic Intellectual Property Management Co., Ltd. | 33375 |
55 |
| FANUC Corporation | 7004 |
48 |
| IPG Photonics Corporation | 570 |
39 |
| TRUMPF Laser- und Systemtechnik GmbH | 532 |
37 |
| Seurat Technologies, Inc. | 164 |
37 |
| Toyota Motor Corporation | 34313 |
36 |
| Nikon Corporation | 7249 |
34 |
| Samsung Display Co., Ltd. | 37602 |
33 |
| General Electric Company | 13809 |
30 |
| Disco Corporation | 1920 |
30 |
| Etxe-tar, S.A. | 61 |
24 |
| Electro Scientific Industries, Inc. | 365 |
23 |
| Mitsubishi Electric Corporation | 47511 |
22 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6114 |
22 |
| Precitec GmbH & Co. KG | 199 |
21 |
| Mitsubishi Heavy Industries, Ltd. | 9004 |
20 |
| Amada Company, Limited | 603 |
19 |
| LG Energy Solution, Ltd. | 17267 |
18 |
| Amada Holdings Co., Ltd. | 272 |
17 |
| Hamamatsu Photonics K.K. | 4590 |
16 |
| Other owners | 1498 |