- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 103/00 - Materials to be soldered, welded or cut
Patent holdings for IPC class B23K 103/00
Total number of patents in this class: 1993
10-year publication summary
|
267
|
243
|
213
|
178
|
193
|
148
|
104
|
105
|
124
|
10
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1914 |
137 |
| Corning Incorporated | 10340 |
91 |
| Hamamatsu Photonics K.K. | 4551 |
49 |
| SCHOTT AG | 1720 |
39 |
| TRUMPF Laser- und Systemtechnik GmbH | 532 |
37 |
| Seurat Technologies, Inc. | 163 |
34 |
| Samsung Display Co., Ltd. | 36881 |
28 |
| Applied Materials, Inc. | 19474 |
28 |
| 4JET Microtech GmbH | 53 |
27 |
| Siltectra GmbH | 88 |
25 |
| Agc, Inc. | 5098 |
20 |
| IPG Photonics Corporation | 563 |
19 |
| Luxwall, Inc. | 108 |
17 |
| Rtx Corporation | 9660 |
17 |
| Saint-Gobain Glass France | 3228 |
16 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46375 |
14 |
| AGC Glass Europe | 1148 |
14 |
| Apple Inc. | 56723 |
13 |
| Levi Strauss & Co. | 306 |
13 |
| Samsung Electronics Co., Ltd. | 150361 |
11 |
| Other owners | 1344 |