- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 103/00 - Materials to be soldered, welded or cut
Patent holdings for IPC class B23K 103/00
Total number of patents in this class: 1813
10-year publication summary
|
256
|
267
|
243
|
212
|
173
|
185
|
132
|
75
|
85
|
51
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1846 |
120 |
| Corning Incorporated | 10184 |
113 |
| Hamamatsu Photonics K.K. | 4378 |
42 |
| TRUMPF Laser- und Systemtechnik GmbH | 533 |
36 |
| SCHOTT AG | 1706 |
33 |
| Seurat Technologies, Inc. | 158 |
30 |
| Samsung Display Co., Ltd. | 34061 |
26 |
| Applied Materials, Inc. | 18334 |
25 |
| Siltectra GmbH | 88 |
25 |
| IPG Photonics Corporation | 519 |
19 |
| Agc, Inc. | 4691 |
19 |
| Saint-Gobain Glass France | 3781 |
18 |
| Rtx Corporation | 9280 |
17 |
| Apple Inc. | 54252 |
13 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 41903 |
13 |
| General Electric Company | 17062 |
12 |
| AGC Glass Europe | 1112 |
12 |
| Levi Strauss & Co. | 330 |
12 |
| ArcelorMittal | 2187 |
11 |
| LPKF Laser & Electronics AG | 91 |
11 |
| Other owners | 1206 |